Solder Possu50-0,5

  • POM2 solder
  • Solder PIC61
  • Solder POS61M
  • Solder PIC63
  • Solder PIC90
  • Solder POSK50-18
  • Solder PSSu50-0,5
  • Solder PSSu61-0,5
  • Solder POSU95-5

    • Designation

    Name The value
    Designation GOST Cyrillic ПОССу50-0,5
    Designation GOST Latin POCCu50-0,5
    Transliteration POSSu50-05
    By chemical elements ПSnPbSb50-0,5

    Description

    Solder Possu50−0,5 applies: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering of aircraft radiators, soldering, food dishes, followed by tinned food with tin; for low-temperature (soft) capillary soldering of fittings from copper and copper alloys are designed for connection to copper pipes (according to GOST R 52318) used in drinking water systems, hot and cold water, water (steam) heating, cooling, sewage, water treatment plants and gas supply.

    Note

    Tin-lead solder measurementi.

    Standards

    Name Code Standards
    Non-ferrous metals, including rare, and their alloys В51 GOST 21930-76, GOST 21931-76, GOST 28873-90, GOST Р 52955-2008

    Chemical composition

    Standard S Ni Fe Cu As Al Zn Sn Sb Pb Bi
    GOST 21930-76 ≤0.02 ≤0.02 ≤0.02 ≤0.05 ≤0.02 ≤0.002 ≤0.002 49-51 0.05-0.5 Rest ≤0.1
    GOST Р 52955-2008 ≤0.02 ≤0.02 ≤0.02 ≤0.08 ≤0.03 - ≤0.002 49-51 0.2-0.5 Rest ≤0.1
    Sn is the basis.

    Mechanical properties

    σU, MPa d KCU, kJ/m2 HB, MPa
    Pig in the state of delivery
    ≥37.28 ≥62 ≥431.2 ≥13.2

    Description mechanical marks

    Name Description
    σU Limit short-term strength
    d Elongation after rupture
    KCU Toughness
    HB Brinell hardness number

    Physical characteristics

    Temperature r, kg/m3 l, W/(m · °C) R, Mr. · m
    20 8900 469 149

    A description of the physical symbols

    Name Description
    l Coefficient of thermal conductivity
    С Specific heat