Designation
| Name |
The value |
| Designation GOST Cyrillic |
ПОС90 |
| Designation GOST Latin |
POC90 |
| Transliteration |
POS90 |
| By chemical elements |
ПSnPb90 |
Description
Solder POS90 used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering of the inner seams of food utensils and medical equipment.
Note
Tin-lead solder antimony free.
Standards
| Name |
Code |
Standards |
| Non-ferrous metals, including rare, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90 |
Chemical composition
| Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
| GOST 21930-76 |
≤0.02 |
≤0.02 |
≤0.02 |
≤0.05 |
≤0.01 |
≤0.002 |
≤0.002 |
89-91 |
≤0.1 |
Rest |
≤0.1 |
Sn is the basis.
Mechanical properties
| σU, MPa |
d |
KCU, kJ/m2 |
HB, MPa |
| Pig in the state of delivery |
| ≥48.07 |
≥40 |
≥411.6 |
≥15.4 |
Description mechanical marks
| Name |
Description |
| σU |
Limit short-term strength |
| d |
Elongation after rupture |
| KCU |
Toughness |
| HB |
Brinell hardness number |
Physical characteristics
| Temperature |
r, kg/m3 |
l, W/(m · °C) |
R, Mr. · m |
| 20 |
7600 |
5443 |
120 |
A description of the physical symbols
| Name |
Description |
| l |
Coefficient of thermal conductivity |
| С |
Specific heat |