Solder POS61M

  • POM2 solder
  • Solder PIC61
  • Solder POS61M
  • Solder PIC63
  • Solder PIC90
  • Solder POSK50-18
  • Solder PSSu50-0,5
  • Solder PSSu61-0,5
  • Solder POSU95-5

    • Designation

    Name The value
    Designation GOST Cyrillic ПОС61М
    Designation GOST Latin POC61M
    Transliteration POS61M
    By chemical elements ПSnPb61Cu

    Description

    Solder POS61M used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering electrosolderers thin (thickness less than 0.2 mm) copper wires, foil, printed conductors in the cable, the electrical and electronic industry.

    Note

    Tin-lead solder-copper and antimony free. The use of solder for tinning and soldering in the crucible and the bath is not allowed.

    Standards

    Name Code Standards
    Non-ferrous metals, including rare, and their alloys В51 GOST 21930-76, GOST 21931-76, GOST 28873-90

    Chemical composition

    Standard S Ni Fe Cu As Al Zn Sn Sb Pb Bi
    GOST 21930-76 ≤0.02 ≤0.02 ≤0.02 1.2-2 ≤0.01 ≤0.002 ≤0.002 59-61 ≤0.2 Rest ≤0.1
    Sn is the basis.

    Mechanical properties

    σU, MPa d KCU, kJ/m2 HB, MPa
    Pig in the state of delivery
    ≥44.15 ≥40 ≥107.8 ≥14.9

    Description mechanical marks

    Name Description
    σU Limit short-term strength
    d Elongation after rupture
    KCU Toughness
    HB Brinell hardness number

    Physical characteristics

    Temperature r, kg/m3 l, W/(m · °C) R, Mr. · m
    20 8500 4899 143

    A description of the physical symbols

    Name Description
    l Coefficient of thermal conductivity
    С Specific heat