Designation
Name |
The value |
Designation GOST Cyrillic |
ПОСК50-18 |
Designation GOST Latin |
POCK50-18 |
Transliteration |
POSK50-18 |
By chemical elements |
ПSnPbCo50-18 |
Description
Solder POSK50−18 is used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for brazing of parts sensitive to overheating, metalized ceramics, for step soldering capacitors.
Note
Solder tin-lead-cadmium antimony free.
Standards
Name |
Code |
Standards |
Non-ferrous metals, including rare, and their alloys |
В51 |
GOST 21930-76, GOST 21931-76, GOST 28873-90 |
Norms for calculation and design |
В02 |
OST 107.460091.001-86 |
Chemical composition
Standard |
S |
Ni |
Fe |
Cu |
As |
Al |
Zn |
Sn |
Sb |
Pb |
Bi |
Cd |
GOST 21930-76 |
≤0.02 |
≤0.02 |
≤0.02 |
≤0.08 |
≤0.03 |
≤0.002 |
≤0.002 |
49-51 |
≤0.2 |
Rest |
≤0.1 |
17-19 |
Sn is the basis.
Mechanical properties
σU, MPa |
d |
HB, MPa |
HRC |
Pig in the state of delivery |
≥39.2 |
≥40 |
≥480.2 |
≥14 |
Description mechanical marks
Name |
Description |
σU |
Limit short-term strength |
d |
Elongation after rupture |
HB |
Brinell hardness number |
HRC |
Rockwell hardness (indenter diamond spheroconical) |
Physical characteristics
Temperature |
r, kg/m3 |
l, W/(m · °C) |
R, Mr. · m |
20 |
8800 |
5443 |
133 |
A description of the physical symbols
Name |
Description |
l |
Coefficient of thermal conductivity |
С |
Specific heat |