Copper DP-80 (T-80)

  • Copper DP-87 (D-87)
  • Solder ПДОл5П7 (ППМОФ 5-5)
  • Alloy MK-5
  • Alloy MK-403
  • Brass LPSv80-1-84 (LSv80-1-84)
  • Brass LPSv80-1-78 (LSv80-1-78)
  • Brass LP80-84 (L80-84)
  • Brass LP80-82 (L80-82)
  • Brass LP80-78 (L80-78)
  • Copper DP-80 (D-80)
  • Alloy BS-1
  • BrCr bronze
  • Bronze BrPO10-86
  • Bronze BrPO10-77
  • Bronze БрА8,5Ж1,5Н5Мц1,5 (БрАЖНМц8,5-1,5-5-1,5)
  • Alloy BMK-1
  • Alloy 263

    • Designation

    Name The value
    Designation GOST Cyrillic ДП-80
    Designation GOST Latin DP-80
    Transliteration DP-80
    By chemical elements ДП-80
    Name The value
    Designation GOST Cyrillic Д-80
    Designation GOST Latin D-80
    Transliteration D-80
    By chemical elements Д-80

    Description

    Copper DP-80 used: for the manufacture by the method of single pressing electrical and electronic structural components (contacts, parts, RF connectors, parts of the waveguide nodes).

    Note

    The copper powder.
    The material should be applied after the impregnation with compounds that protect against internal corrosion. Compositions for the impregnation in accordance with OST 4G 0.054.213.

    Standards

    Name Code Standards
    Hard alloys, ceramic-metal products and metal powder В56 OST 107.460094.118-88, OST 107.460009.002-90

    Chemical composition

    Standard Cu
    OST 107.460094.118-88 Rest
    Cu is the basis.

    Mechanical properties

    Section, mm σU, MPa d HB, MPa
    Properties of the material to heat treatment at OST 107.460094.118-88
    ≥137 ≥12 ≥40

    Description mechanical marks

    Name Description
    σU Limit short-term strength
    d Elongation after rupture
    HB Brinell hardness number

    Physical characteristics

    Temperature r, kg/m3
    20 8000

    A description of the physical symbols

    Name Description
    Е The normal elasticity modulus
    l Coefficient of thermal conductivity
    С Specific heat