Designation
Name |
The value |
Designation GOST Cyrillic |
ДП-87 |
Designation GOST Latin |
DP-87 |
Transliteration |
DP-87 |
By chemical elements |
ДП-87 |
Name |
The value |
Designation GOST Cyrillic |
Д-87 |
Designation GOST Latin |
D-87 |
Transliteration |
D-87 |
By chemical elements |
Д-87 |
Description
Copper DP-87 is used: for the manufacture by cold deformation, electrical and electronic structural components (contacts, parts, RF connectors, parts of the waveguide nodes).
Note
The copper powder.
The material should be applied after the impregnation with compounds that protect against internal corrosion. Compositions for the impregnation in accordance with OST 4G 0.054.213.
Standards
Name |
Code |
Standards |
Hard alloys, ceramic-metal products and metal powder |
В56 |
OST 107.460094.118-88, OST 107.460009.002-90 |
Chemical composition
Standard |
Cu |
OST 107.460094.118-88 |
Rest |
Cu is the basis.
Mechanical properties
Section, mm |
σU, MPa |
d |
KCU, kJ/m2 |
HB, MPa |
Properties of the material to heat treatment at OST 107.460094.118-88 |
|
≥196 |
≥4 |
≥294 |
≥65 |
Description mechanical marks
Name |
Description |
σU |
Limit short-term strength |
d |
Elongation after rupture |
KCU |
Toughness |
HB |
Brinell hardness number |
Physical characteristics
Temperature |
r, kg/m3 |
20 |
8600 |
A description of the physical symbols
Name |
Description |
Е |
The normal elasticity modulus |
l |
Coefficient of thermal conductivity |
С |
Specific heat |