Designation
Name |
The value |
Designation GOST Cyrillic |
ЛП80-82 |
Designation GOST Latin |
LP80-82 |
Transliteration |
LP80-82 |
By chemical elements |
ЛП80-82 |
Name |
The value |
Designation GOST Cyrillic |
Л80-82 |
Designation GOST Latin |
L80-82 |
Transliteration |
L80-82 |
By chemical elements |
Л80-82 |
Description
Brass ЛП80−82 is used: for the manufacture by the method of double pressing, electrical and electronic structural components (contacts, parts, RF connectors, parts of the waveguide nodes).
Note
Brass powder.
The material should be applied after the impregnation with compounds that protect against internal corrosion. Compositions for the impregnation in accordance with OST 4G 0.054.213.
Standards
Name |
Code |
Standards |
Hard alloys, ceramic-metal products and metal powder |
В56 |
OST 107.460094.118-88, OST 107.460009.002-90 |
Chemical composition
Standard |
Cu |
Zn |
OST 107.460094.118-88 |
78-82 |
18-22 |
Cu is the basis.
Mechanical properties
Section, mm |
σU, MPa |
d |
HB, MPa |
Material properties for OST 107.460094.118-88 after heat treatment: high temperature annealing at 750-850 °C (extract 50-70 min), air cooling |
|
≥225 |
≥20 |
55-75 |
Material properties for OST 107.460094.118-88 after heat treatment: low temperature annealing at 300-380 °C (extract 100-140 min), air cooling |
|
≥245 |
≥8 |
65-110 |
Description mechanical marks
Name |
Description |
σU |
Limit short-term strength |
d |
Elongation after rupture |
HB |
Brinell hardness number |
Physical characteristics
Temperature |
R, Mr. · m |
20 |
60 |
A description of the physical symbols
Name |
Description |
Е |
The normal elasticity modulus |
l |
Coefficient of thermal conductivity |
С |
Specific heat |