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General characteristics of aluminum solders

Difficulties in obtaining an optimal solder formula for joining aluminum and its alloys are caused by the fact that these alloys have developed eutectics, which limit the versatility of solder applications.

Solders. Aluminum-silicon .

Aluminum and silicon form a simple metallographic system with a eutectic that corresponds to 11.7% silicon. Such an alloy is notable for its low melting point, which is ⁵⁷⁷⁰ C. The best known alloys of this group are silumins, which contain 4...13% silicon. All are characterized by good fluidity at temperatures not exceeding 630 °C. Silumins have disadvantage of low plasticity properties that is why parts joined with them should not be exposed to tensile loads over 3...4%;

Aluminium-copper

Aluminum-copper. They are used along with aluminum-silicon solders for soldering of aluminum, and although they give a low melting point, they give the soldered seam area increased corrosion characteristics;

Triple aluminum-copper-silicon solders

The most common solder brand triple solder 34A: it has a lower melting point than aluminum-silicon alloys, so while soldering should not be afraid of burning and melting zone connection. The technology for preparing such solder, however, is quite complicated. First an intermediate ligature is prepared, which includes 50% copper and 50% eutectic silumin. Then the mixture is recombined with the required amount of silumin and resmelting of solder in the furnace at 650...700°C. The solder melt is poured into long and narrow molds when ready, forming bars/bars with a cross-section of 4...8 mm.

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Soldering features

The brittleness of all solders containing aluminum forces a wider use of flux-free soldering technology. This method makes it possible to do without the scarce additives - magnesium and germanium. The essence of the process is that easily evaporating components are added to solders. Zinc, antimony and phosphorus are most commonly used. Solders of this type contain about 8...11% of aluminum and silicon, and up to 10% of one of the above elements. The elements are applied as a thin clad layer before the soldering process begins. When heated, these solder components begin to evaporate, accompanied by active dispersion of the aluminum dioxide surface film. Thus, brazing is constantly carried out in a protective atmosphere, at temperatures of 580-600°C. The process can be accelerated by pumping air out of the solder joint formation zone. The result is increased strength and corrosion resistance.

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