Solder ВПр11-40N
Designation
Description
Solder ВПр11−40N is applied: for the soldering of details of aircraft engines and other high-loaded parts, providing seam strength 80% of the strength of the base material at the brazing temperature range from 980 °C to 1020 °C.
Note
High temperature solders based on Nickel is a powder with a particle size up to 250 microns, obtained by spraying in inert gases of the molten metal melted in a vacuum induction furnace.
Standards
Chemical composition
Ni is the basis.
According to TU 1-809-108-91, the chemical composition of the VPP11 solder powder is given, which forms the basis (60%) of the high-temperature solder VPr11-40H. The total amount of impurities of tin, lead and bismuth in solder VPr11 should not exceed 0.5%.
The filler consists of nickel (base), silicon (1.80-2.20%) and boron (0.60-1.20%). The total amount of impurities of tin, lead and bismuth in the filler should also not exceed 0.5%.
According to TU 1-809-108-91, the chemical composition of the VPP11 solder powder is given, which forms the basis (60%) of the high-temperature solder VPr11-40H. The total amount of impurities of tin, lead and bismuth in solder VPr11 should not exceed 0.5%.
The filler consists of nickel (base), silicon (1.80-2.20%) and boron (0.60-1.20%). The total amount of impurities of tin, lead and bismuth in the filler should also not exceed 0.5%.